Organic light emitting diode display, manufacturing method thereof, and rotating device for circuit film

ABSTRACT

A manufacturing method of an organic light emitting diode (OLED) display includes: supplying a circuit film on the pad area of the display panel and bonding a first end portion of the circuit film to the pad area; vertically standing and inserting the display panel in a bonding device; holding a portion of the circuit film including a second end portion to be horizontal by using a rotating device including a vacuum absorbing portion; supplying a flexible printed circuit (FPC) into a space under the second end portion of the circuit film, and attaching the flexible printed circuit to the second end portion of the circuit film; and operating the rotating device to move the second end portion to a vertical position, and separating the circuit film from the vacuum absorbing portion.

CLAIM OF PRIORITY

This application claims priority to and the benefit of Korean PatentApplication No. 10-2012-0114826 filed in the Korean IntellectualProperty Office on Oct. 16, 2012, the entire contents of which areincorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The described technology relates generally to an organic light emittingdiode (OLED) display. More particularly, the described technologyrelates generally to an organic light emitting diode (OLED) displayincluding a circuit film and a flexible printed circuit (FPC), amanufacturing method thereof, and a rotating device of a circuit filmused in a manufacturing process of the organic light emitting diode(OLED) display.

2. Description of the Related Art

Unlike the liquid crystal display (LCD), an organic light emitting diode(OLED) display does not require a separate light source, thereby makingit possible to be implemented as a slim and lightweight display.Furthermore, the OLED display has high quality characteristics such aslower power consumption, high luminance, and short response time.

The organic light emitting diode (OLED) display includes a display panelhaving a plurality of signal lines and a plurality of pixels, a flexibleprinted circuit (FPC) formed with a control circuit transmitting acontrol signal to the display panel, and a circuit film connecting thedisplay panel and the flexible printed circuit (FPC). The circuit filmis formed of a flexible printed circuit film, a chip on film, or a tapecarrier package.

The display panel includes a substrate and an encapsulation membercovering and protecting a plurality of pixels formed on the substrate.One end of the circuit film is a pad region of the substrate, and theother end of the circuit film that is away from the substrate isattached to the flexible printed circuit (FPC).

In a case of a top light emitting type in which the light of the displaypanel is transmitted through the encapsulation member to be emitted, thecircuit film is bent toward an outer surface of the substrate for theflexible printed circuit (FPC) to be positioned outside the substrate.In a case of a bottom light emitting type in which the light of thedisplay panel is transmitted through the substrate to be emitted, thecircuit film is bent toward the encapsulation member for the flexibleprinted circuit (FPC) to be positioned outside the encapsulation member.

In the above-described structure, the circuit film is attached to thesubstrate and then is bent such that adherence with the substratebecomes weak and moisture penetrates into an adhesion portion with thesubstrate, and thereby adhesion reliability may deteriorate. Also, alength of the circuit film must be increased to bend the circuit filmand a dead space is expanded by the bent portion of the circuit filmthat is positioned outside a pad region of the substrate thereby causingan increase in the width of a bezel.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the describedtechnology and therefore it may contain information that does not formthe prior art that is already known in this country to a person ofordinary skill in the art.

SUMMARY

The present invention provides an organic light emitting diode (OLED)display improving an adhesion structure of a circuit film and a flexibleprinted circuit (FPC) to increase adhesion reliability of a circuit filmand to reduce a dead space, and a manufacturing method thereof. Also,the present invention provides a rotating device of a circuit film usedin a manufacturing process of an organic light emitting diode (OLED)display.

An organic light emitting diode (OLED) display according to an exemplaryembodiment includes: a display panel including a substrate having adisplay area and a pad area, and an encapsulation member covering thedisplay area; a flexible printed circuit (FPC) positioned outside theencapsulation member; and a circuit film including a first end portionformed with a first bonding surface that is attached to the pad area anda second end portion formed with a second bonding surface that isattached to the flexible printed circuit (FPC). The circuit filmmaintains a flatness from the first end portion to the second endportion, and the first bonding surface and the second bonding surfaceare positioned facing the substrate.

The organic light emitting diode display may include a gate driver, gatewires, a data driver, data wires, and a plurality of pixels. The displaypanel may include the plurality of pixels positioned on the displayarea, and the display panel may include the gate wires and the datawires positioned on both the display area and the pad area.

At least one of the gate driver and the data driver may be installed tothe circuit film to drive the display panel, and the circuit film may bemade of a chip on film or a tape carrier package. The gate driver andthe data driver may be positioned on the pad area as a chip on glass,and the circuit film may be made of a flexible printed circuit film.

A manufacturing method of an organic light emitting diode (OLED) displayaccording to an exemplary embodiment includes: supplying a circuit filmon a pad area of a display panel and bonding a first end portion of thecircuit film to the pad area; vertically standing the display panel andinserting the display panel in a bonding device; holding a portion ofthe circuit film including a second end portion and moving the secondend portion to a horizontal position by operating a rotating deviceincluding a vacuum absorbing portion; supplying a flexible printedcircuit (FPC) into a space under the second end portion of the circuitfilm, and attaching the flexible printed circuit (FPC) to the second endportion of the circuit film; and operating the rotating device to movethe second end portion to a vertical position, and separating thecircuit film from the vacuum absorbing portion.

The display panel may include a substrate having a display area and apad area, and an encapsulation member covering the display area. In thestep of supplying the circuit film on the pad area of the display panel,the circuit film may be disposed on the display panel such that thefirst end portion may overlap the pad area and the second end portionmay overlap the encapsulation member. In the step of supplying thecircuit film on the pad area of the display panel, the display panel maybe maintained in a state of being parallel to a ground surface.

The rotating device may include: a vacuum absorbing portion including aplurality of vacuum nozzles and absorbing a portion of the circuit filmincluding the second end portion by using a vacuum pressure; aconnection pipe connected to the vacuum absorbing portion; and a driverinstalled to an end portion of the connection pipe and having acapability of rotating the connection pipe and the vacuum absorbingportion by 90 degrees.

The rotating device may comprise a plurality of vacuum absorbingportions. The number of the vacuum absorbing portions may be the same asa number of circuit films arranged on the pad area, and the connectionpipe may be coupled to a plurality of vacuum absorbing portions. Anadhesion member made of an anisotropic conductive film (ACF) may bepositioned between the first bonding surface of the first end portionand the pad area, and may be positioned between the second bondingsurface of the second end portion and the flexible printed circuit(FPC).

A rotating device for a circuit film according to an exemplaryembodiment is installed in a bonding device bonding a circuit film and aflexible printed circuit (FPC). The rotating device holds an end portionof the circuit film to be horizontal. The rotating device includes: aplurality of vacuum absorbing portions with each of the vacuum absorbingportions including a plurality of vacuum nozzles at one surface facingthe circuit film and absorbing a portion of the circuit film by using avacuum pressure; a connection pipe connected to the plurality of vacuumabsorbing portions where the connection pipe includes an inner spaceconnected to an interior of the plurality of vacuum absorbing portions;a driver installed to an end portion of the connection pipe and having acapability of rotating the connection pipe and the plurality of vacuumabsorbing portions by 90 degrees; and a vacuum pump and a control valveconnected to the connection pipe.

Each of the plurality of the vacuum absorbing portions may furtherinclude at least one vacuum pad manufactured of an elastic material. Thedriver may include a rotating axis coupled to the connection pipe in anend portion of the connection pipe, and a driving motor coupled to therotating axis. The rotating axis of the driver may be positioned offfrom a center line of the connection pipe, the rotating device for thecircuit film may further include a coupling member coupling theconnection pipe to the rotating axis while closing and sealing the endportion of the connection pipe.

The circuit film of the organic light emitting diode (OLED) display isattached to the substrate and is not bent such that adhesion reliabilitydeterioration such as adherence weakness or moisture penetration is notgenerated and it is not protruded outside the display panel such thatthe dead space may be reduced. In the manufacturing process of theorganic light emitting diode (OLED) display, the sufficient space wherethe display panel is not interfered with under the second end portion ofthe circuit film by the rotating device is provided such that thebonding work of the circuit film and the flexible printed circuit (FPC)may be easily performed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top plan view of an organic light emitting diode (OLED)display according to the first exemplary embodiment.

FIG. 2 is a cross-sectional view of the organic light emitting diode(OLED) display of FIG. 1 taken along the line A-A.

FIG. 3 is a schematic diagram of a display panel among the organic lightemitting diode (OLED) display of FIG. 1.

FIG. 4 is a cross-sectional view of an organic light emitting diode(OLED) display according to the second exemplary embodiment.

FIG. 5 is a process flowchart of a manufacturing method of an organiclight emitting diode (OLED) display according to the third exemplaryembodiment.

FIG. 6 and FIG. 7 are cross-sectional views of an organic light emittingdiode (OLED) display of the first step and the second step shown in FIG.5.

FIG. 8 is an enlarged perspective view of the organic light emittingdiode (OLED) display of the third step shown in FIG. 5.

FIG. 9 is a perspective view of a vacuum absorbing portion among therotating device shown in FIG. 8.

FIG. 10 and FIG. 11 are cross-sectional views of an organic lightemitting diode (OLED) display of the fourth step and the fifth stepshown in FIG. 5.

DETAILED DESCRIPTION

The present invention will be described more fully hereinafter withreference to the accompanying drawings, in which exemplary embodimentsof the invention are shown. As those skilled in the art would realize,the described embodiments may be modified in various different ways, allwithout departing from the spirit or scope of the present invention.

Unless explicitly described to the contrary, the word “comprise” andvariations such as “comprises” and “comprising” will be understood toimply the inclusion of stated elements but not the exclusion of anyother elements. In addition, it will be understood that when an elementsuch as a layer, film, region, or substrate is referred to as being “on”another element, it can be directly on the other element or interveningelements may also be present. Throughout this specification, it isunderstood that the term “on” and similar terms are used generally andare not necessarily related to a gravitational reference.

FIG. 1 is a top plan view of an organic light emitting diode (OLED)display according to the first exemplary embodiment, and FIG. 2 is across-sectional view of the organic light emitting diode (OLED) displayof FIG. 1 taken along the line A-A.

Referring to FIG. 1 and FIG. 2, the organic light emitting diode (OLED)display 100 of the first exemplary embodiment includes a display panel10 displaying an image, a flexible printed circuit (FPC) 20 including acontrol circuit transmitting a control signal to the display panel 10,and a circuit film 30 electrically and physically connecting the displaypanel 10 to the flexible printed circuit (FPC) 20.

The circuit film 30 as an insulating film such as polyimide including awire pattern includes a first end portion 31 attached to the displaypanel 10 and a second end portion 32 attached to the flexible printedcircuit (FPC) 20. The circuit film 30 totally overlaps the display panel10 and does not include a bent portion or a portion that is protrudedoutside the display panel 10. That is, the circuit film 30 substantiallymaintains flatness from the first end portion 31 to the second endportion 32.

FIG. 3 is a schematic diagram of a display panel among the organic lightemitting diode (OLED) display of FIG. 1.

Referring to FIG. 3, the display panel 10 includes a substrate 11, agate driver GD, gate wires GW, a data driver DD, data wires DW, and aplurality of pixels PE. Here, the pixel PE is a minimum unit displayingan image, and the display panel 10 displays the image by using the lightemitted from the plurality of pixels PE.

The gate driver GD is connected to the gate wires GW, and the gate wiresGW include scan lines S1-SCn. The gate driver GD sequentially supplies ascan signal to the gate wires GW corresponding to a control signalsupplied by an external control circuit, for example, a timingcontroller. The pixel PE is selected by the scan signal to sequentiallyreceive a data signal.

The data driver DD is connected to the data wires DW, and the data wiresDW include the data lines D1-Dm and a driving power source line ELVDDL.The driving power source line ELVDDL is connected to the first powersource ELVDD from the outside and receives driving power from the firstpower source ELVDD.

The data driver DD supplies a data signal to a data line DAm from amongthe data wires DW corresponding to a control signal supplied by thetiming controller. The data signal supplied to the data line DAm issupplied to the pixel PE selected by the scan signal when the scansignal is supplied to the scan line SCn. The pixel PE is charged with avoltage corresponding to the data signal and emits light withcorresponding luminance.

The pixel PE is positioned at a region where the gate wires GW and thedata wires DW are crossed, and is connected to the gate wires GW and thedata wires DW. The pixel PE includes the first power source ELVDD, twothin film transistors (a switching transistor and a driving transistor),a capacitor connected to the gate wires GW and the data wires DW, and anorganic light emitting element connected to the second power sourceELVSS via the thin film transistor.

The organic light emitting diode (OLED) includes an anode connected toan output terminal of the driving transistor, a cathode connected to thesecond power source ELVSS, and an organic emission layer positionedbetween the anode and the cathode. The organic light emitting diode(OLED) emits light having intensity depending on an output current ofthe driving transistor, and thereby the display panel 10 including aplurality of pixels PE displays predetermined images.

Referring to FIG. 1 to FIG. 3, the display panel 10 includes thesubstrate 11 having a display area DA and a pad area PA positionedoutside the display area DA, and an encapsulation member 12 fixed on thesubstrate 11 to cover the display area DA. FIG. 1 exemplarilyillustrates the pad area PA that is positioned at lower and upper endportions of the display panel 10, but the location of the pad area PA isnot limited thereto.

The substrate 11 is formed of a transparent insulation substrate such asglass or polymer, and when the substrate 11 is formed of the polymerfilm, a flexible characteristic may be provided. The encapsulationmember 12 may be formed of glass, a polymer film, a metal, or a thinfilm encapsulation layer in which a plurality of organic layers and aplurality of inorganic layers are alternately and repeatedly depositedat least one time. The encapsulation member 12 encapsulates theplurality of pixels PE to protect them from external moisture andoxygen.

The plurality of pixels PE are positioned in the display area DA, andthe gate wires GW and the data wires DW are entirely positioned in thedisplay area DA and the pad area PA. At least one of the gate driver GDand the data driver DD may be mounted to the circuit film 30 as adriving chip 41. In the organic light emitting diode (OLED) display 100of the first exemplary embodiment, the circuit film 30 may beconstituted of a chip on film or a tape carrier package, including thedriving chip 41.

The display panel 10 is a bottom light emitting type in which the lightemitted from the plurality of pixels PE is transmitted through thesubstrate 11 to be emitted. In FIG. 2, a direction in which the light isemitted is indicated by an arrow. The flexible printed circuit (FPC) 20is positioned outside the encapsulation member 12 for the light emittedfrom the display area DA to not be covered.

The first end portion 31 of the circuit film 30 positioned on the padarea PA, and the second end portion 32 of the circuit film 30 ispositioned on the flexible printed circuit (FPC) 20. The first endportion 31 of the circuit film 30 is fixed to the pad area PA by anadhesion member 42, and the second end portion 32 of the circuit film 30is fixed to the flexible printed circuit (FPC) 20 by the adhesion member42. The adhesion member 42 may be formed of an anisotropic conductivefilm (ACF) in which conductive particles are dispersed in athermosetting or thermoplastic resin layer.

The circuit film 30 totally overlaps the display panel 10 without aportion that is protruded outside the display panel 10 and does notinclude a bent portion. In other words, the circuit film 30 is coveredby the display panel 10. Accordingly, the circuit film 30 maintainsflatness from the first end portion 31 to the second end portion 32.Here, to maintain the flatness means that the circuit film 30 does notinclude a portion that is bent or curved. However, the circuit film 30may have a portion that is slightly deformed by a height difference ofthe pad area PA and the flexible printed circuit (FPC) 20.

The first bonding surface BS1 attached to the pad area PA is formed inthe first end portion 31 of the circuit film 30, and the second bondingsurface BS2 attached to the flexible printed circuit (FPC) 20 is formedin the second end portion 32. The first bonding surface BS1 and thesecond bonding surface BS2 are positioned to be toward the substrate 11.In other words, the first and second bonding surfaces BS1 and BS2 facethe substrate 11 from the circuit film 30. The first bonding surface BS1and the second bonding surface BS2 are areas exposing a wire pattern ofthe circuit film 30, and the first bonding surface BS1 and the secondbonding surface BS2 are positioned at the same surface of the circuitfilm 30 thereby using the circuit film 30 having a simple layering wirestructure.

In the above-described organic light emitting diode (OLED) display 100,the circuit film 30 is not bent after being attached to the substrate 11such that adhesion reliability deterioration such as adherence weaknessor moisture penetration is not generated. Also, it is not necessary tobend the circuit film 30 such that the length of the circuit film 30 maybe reduced, and the circuit film 30 is protruded outside the displaypanel 10 such that the dead space may be reduced and the width of thebezel may be reduced.

FIG. 4 is a cross-sectional view of an organic light emitting diode(OLED) display according to the second exemplary embodiment.

Referring to FIG. 3 and FIG. 4, in the organic light emitting diode(OLED) display 200 according to the second exemplary embodiment, thegate driver GD and the data driver DD are positioned on the pad areawith the chip on glass type, and a circuit film 301 is formed of aflexible printed circuit film without the driving chip. In FIG. 4,reference numeral 411 indicates a driving chip functioning as the gatedriver GD or the data driver DD.

An organic light emitting diode (OLED) display 200 of the secondexemplary embodiment has the same configuration as the organic lightemitting diode (OLED) display 100 of the first exemplary embodimentexcept for the position of the driving chip 411 and the kind of circuitfilm 301.

That is, the circuit film 301 of the second exemplary embodimententirely overlaps the display panel 10 without a portion that isprotruded outside the display panel 10 and does not include a bentportion. In other words, the circuit film 30 is covered by the displaypanel 10. The circuit film 301 maintains the flatness from the first endportion 31 to the second end portion 32, and the first bonding surfaceBS1 and the second bonding surface BS2 are positioned to be toward thesubstrate 11.

Meanwhile, a manufacturing process of the described organic lightemitting diode (OLED) displays 100 and 200 includes a first bonding stepbonding the first end portion 31 of the circuit films 30 and 301 to thepad area PA of the substrate 11 and a second bonding step bonding theflexible printed circuit (FPC) 20 to the second end portion 32 of thecircuit films 30 and 301.

At this time, in the second bonding step, the second end portion 32 ofthe circuit films 30 and 301 is positioned within the periphery of thedisplay panel 10 such that bonding work of the circuit films 30 and 301and the flexible printed circuit (FPC) 20 by using a generalmanufacturing device that is optimized for a case that the second endportion 32 of the circuit films 30 and 301 is positioned outside thedisplay panel 10 is difficult.

Next, a manufacturing method of the organic light emitting diode (OLED)displays 100 and 200 that is capable of easily bonding the circuit films30 and 301 and the flexible printed circuit (FPC) 20 will be described.

FIG. 5 is a process flowchart of a manufacturing method of an organiclight emitting diode (OLED) display according to the third exemplaryembodiment.

Referring to FIG. 5, the manufacturing method of the organic lightemitting diode (OLED) display according to the third exemplaryembodiment includes a first step S10 of bonding the first end portion ofthe circuit film to the pad area of the display panel, a second step S20of vertically standing and inserting the display panel in a bondingdevice, a third step S30 of taking up a portion of the circuit filmincluding the second end portion to be horizontal by using a rotatingdevice, a fourth step S40 of bonding the flexible printed circuit (FPC)to the second end portion of the circuit film, and a fifth step S50 ofreturning the rotating device to an original position and dischargingthe display panel.

FIG. 6 is a cross-sectional view of the organic light emitting diode(OLED) display of the first step S10 shown in FIG. 5.

Referring to FIG. 6, the adhesion member 42 and the circuit film 30 areprovided on the pad area PA of the display panel 10 in the first stepS10. The circuit film 30 is disposed on the display panel 10 such thatthe first end portion 31 overlaps the adhesion member 42 and the padarea PA, and the second end portion 32 overlaps the encapsulation member12. At this time, the display panel 10 may be maintained parallel to aground surface.

Next, heat and pressure are provided to the first end portion 31 of thecircuit film 30. Thus, while the conductive particles inside theadhesion member 42 contact the wire of the pad area PA and the wire ofthe first bonding surface BS1, the pad area PA and the circuit film 30are electrically connected.

FIG. 7 is a cross-sectional view of the organic light emitting diode(OLED) display of the second step S20 shown in FIG. 5.

Referring to FIG. 7, the display panel 10 stands vertically and isinserted in a bonding device (not shown) in the second step S20.Accordingly, the display panel 10 maintains the state of being verticalto the ground surface at 90 degrees in the bonding device.

The bonding device includes a rotating device (element 50 shown in FIG.8) absorbing and taking up the portion of the circuit film 30 includingthe second end portion 32 to be in a horizontal state. The bondingdevice also includes a general device supplying an adhesion member and aflexible printed circuit (FPC) under the second end portion 32 of thecircuit film 30 and providing the heat and the pressure to the secondend portion 32 of the circuit film 30. Next, the rotating device in theboding device will be described with reference to accompanying drawings.

FIG. 8 is an enlarged perspective view of the organic light emittingdiode (OLED) display of the third step shown in FIG. 5, and FIG. 9 is aperspective view of a vacuum absorbing portion among the rotating deviceshown in FIG. 8.

Referring to FIG. 8 and FIG. 9, the portion of the circuit film 30including the second end portion 32 in the third step S30 is absorbed tothe rotating device 50, and then is taken up to be in the horizontalstate. Accordingly, the second end portion 32 of the circuit film 30 isseparated from the encapsulation member 12 such that a sufficient spaceis formed so as to not generate interference with the display panel 10under the second end portion 32. The adhesion member and the flexibleprinted circuit (FPC) are supplied through this space and the flexibleprinted circuit (FPC) may be easily bonded to the second end portion 32.

The rotating device 50 includes a plurality of vacuum absorbing portions51 absorbing the portion of the circuit film 30 including the second endportion 32 by using vacuum pressure, a connection pipe 52 connecting theplurality of vacuum absorbing portions 51 to each other, a driver 53being installed to the end portion of the connection pipe 52 and movingthe connection pipe 52, and a vacuum pump 54 and a control valve 55combined to the connection pipe 52.

The vacuum absorbing portions 51 are provided with the same number asthe circuit films 30 positioned at one end portion of the display panel10, and one vacuum absorbing portion 51 is disposed corresponding toeach circuit film 30. The vacuum absorbing portion 51 has a structure ofa box shape that is empty therein, and a plurality of vacuum nozzles 511are formed at one surface toward the circuit film 30.

The vacuum absorbing portion 51 may further include a pair of vacuumpads 512 made of an elastic material such as a rubber such that theabsorbing of the circuit film 30 may be further smooth. A plurality ofvacuum nozzles 511 are positioned between a pair of vacuum pads 512.

A plurality of vacuum absorbing portions 51 are fixed to the connectionpipe 52, and an inner space of the connection pipe 52 is connected tothe inside of the vacuum absorbing portion 51 and the vacuum pump 54.Accordingly, a vacuum pressure generated by the vacuum pump 54 isuniformly applied to a plurality of vacuum absorbing portions 51 throughthe connection pipe 52, and is used for absorbing (or suctioning) thecircuit film 30. The connection pipe 52 is positioned in parallel to thepad area of the display panel 10.

The driver 53 includes a driving motor 531 and a rotating axis 532. Therotating axis 532 is fixed at a position separated from the shape centerof the connection pipe 52 by a predetermined distance at the end portionof the connection pipe 52. For this, a coupling member 56 couples theconnection pipe 52 to the rotating axis 532 while closing and sealingthe end portions of the connection pipe 52. In FIG. 8, the shape centerof the connection pipe 52 is indicated by a line B, which is a centerline of the connection pipe 52, and the rotating axis 532 is positionedunder the shape center of the connection pipe 52 as shown in FIG. 8. Inother words, the center line B of the connection pipe 52 is off from acenter line of the rotating axis 532.

In FIG. 8, reference numeral 57 represents a supporting membersupporting the connection pipe 52 and the driver 53. If the rotatingaxis 532 is rotated by the operation of the driving motor 531, theconnection pipe 52 is rotated with the center of the rotating axis 532to change the position of the vacuum absorbing portion 51.

In the bonding device, the display panel 10 is inserted before therotating device 50 by a transferring device (not shown) such as a rollertransferring unit. Directly after the insertion of the display panel 10,the vacuum absorbing portion 51 of the rotating device 50 is positionedfor a plurality of vacuum nozzles 511 to face a lower outer surface ofthe circuit film 30. If the vacuum pump 54 is operated and the controlvalve 55 is opened, a vacuum intake is generated at the plurality ofvacuum nozzles 511. Accordingly, the lower portion of the circuit film30 including the second end portion 32 is strongly absorbed to thevacuum absorbing portion 51.

Next, if the rotating axis 532 is rotated by the driving motor 531,while the connection pipe 52 and the vacuum absorbing portion 51 arerotated 90 degrees, the lower portion of the circuit film 30 is taken upto be in the horizontal state. Accordingly, the second end portion 32 ofthe circuit film 30 moves away from the display panel 10, and a space tobond the flexible printed circuit (FPC) is provided under the second endportion 32. At this time, a plurality of vacuum absorbing portions 51are simultaneously rotated by the connection pipe 52 such that aplurality of circuit films 30 are simultaneously taken up.

The described rotating device 50 is not limited to the shown elements,and any structure that absorbs the portion of the circuit film 30 byusing the vacuum pressure and takes up the portion of the absorbedcircuit film 30 by using a physical force may be applicable.

FIG. 10 is a cross-sectional view of an organic light emitting diode(OLED) display of the fourth step shown in FIG. 5.

Referring to FIG. 10, in the fourth step S40, the adhesion member 42 andthe flexible printed circuit (FPC) 20 are supplied to the space underthe second end portion 32 of the circuit film 30. Next, the heat and thepressure are provided to the second end portion 32 of the circuit film30. Thus, while, the conductive particles inside the adhesion member 42contact the wire of the second bonding surface BS2 and the wire of theflexible printed circuit (FPC) 20, the circuit film 30 and the flexibleprinted circuit (FPC) 20 are electrically connected.

In the described third step S30, the space that is not interfered withthe display panel 10 is sufficiently formed under the second end portion32 by the rotating device 50 in the bonding device 60. Accordingly, inthe fourth step S40, the bonding work of the circuit film 30 and theflexible printed circuit (FPC) 20 may be easily performed while a commonmanufacturing device that is optimized to a case that the second endportion 32 of the circuit film 30 is positioned outside the displaypanel 10 is applied as it is or the common manufacturing device is notlargely changed.

FIG. 11 is a cross-sectional view of an organic light emitting diode(OLED) display of the fifth step shown in FIG. 5.

Referring to FIG. 11, in the fifth step S50, the connection pipe 52 andthe vacuum absorbing portion 51 are returned to the original positionand the vacuum pressure is released such that the circuit film 30 isseparated from the vacuum absorbing portion 51. Next, the display panel10 is discharged from the bonding device 60 (shown in FIG. 10) and ismoved to a following process. The display panel 10 that is dischargedfrom the bonding device 60 may be rotated by 90 degrees to be parallelto the ground surface.

FIG. 4 to FIG. 11 illustrate the organic light emitting diode (OLED)display of the first exemplary embodiment, however the manufacturingmethod of the organic light emitting diode (OLED) display of the secondexemplary embodiment is the same as described such that the detaileddescription is omitted.

Meanwhile, as shown in FIG. 1, for the circuit film 30 positioned at thelower end portion of the display panel 10, the bonding work of theflexible printed circuit (FPC) 20 by using the rotating device 50 may beperformed. For this, after the bonding work of the fourth step S40 iscompleted, the display panel 10 is rotated 180 degrees, and the bondingwork of the fourth step S40 may be repeated.

Meanwhile, a rotating device 50 shown in FIG. 8 of two sets may beprovided to the bonding device for the described rotating device to alsoface the lower end portion of the display panel 10. In this case, therotating device facing the lower end portion of the display panel 10 istaken down to be horizontal to an upper portion including the second endportion of the circuit film, and the adhesion member and the flexibleprinted circuit (FPC) are supplied to an upper space of the second endportion of the circuit film.

While this disclosure has been described in connection with what ispresently considered to be practical exemplary embodiments, it is to beunderstood that the invention is not limited to the disclosedembodiments, but, on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims.

1-4. (canceled)
 5. A method of manufacturing an organic light emittingdiode (OLED) display comprising: supplying a circuit film on a pad areaof a display panel and bonding a first end portion of the circuit filmto the pad area; vertically standing the display panel and inserting thedisplay panel in a bonding device; holding a portion of the circuit filmincluding a second end portion and moving the second end portion to ahorizontal position by operating a rotating device; supplying a printedcircuit board (FPCB) into a space under the second end portion of thecircuit film, and attaching the printed circuit board to the second endportion of the circuit film; and operating the rotating device to movethe second end portion to a vertical position, and separating thecircuit film from the rotating device.
 6. The method of claim 5, whereinthe display panel includes a substrate having a display area and a padarea, and an encapsulation member covering the display area, and in thestep of supplying the circuit film on the pad area of the display panel,the circuit film is disposed on the display panel such that the firstend portion overlaps the pad area and the second end portion overlapsthe encapsulation member.
 7. The method of claim 6, wherein in the stepof supplying the circuit film on the pad area of the display panel, thedisplay panel is maintained in a state of being parallel to a groundsurface.
 8. The method of claim 5, wherein the rotating device includes:a vacuum absorbing portion including a plurality of vacuum nozzles andabsorbing a portion of the circuit film including the second end portionby using a vacuum pressure; a connection pipe connected to the vacuumabsorbing portion; and a driver installed to an end portion of theconnection pipe and having a capability of rotating the connection pipeand the vacuum absorbing portion by 90 degrees.
 9. The method of claim8, wherein the rotating device comprises a plurality of vacuum absorbingportions, the number of the vacuum absorbing portions being the same asa number of circuit films arranged on the pad area, and the connectionpipe is coupled to a plurality of vacuum absorbing portions.
 10. Themethod of claim 5, wherein an adhesion member made of an anisotropicconductive film (ACF) is positioned between the first bonding surface ofthe first end portion and the pad area, and is positioned between thesecond bonding surface of the second end portion and the printed circuitboard.
 11. The method of claim 5, wherein the printed circuit board isnot directly connected to the pad area.
 12. The method of claim 10,wherein in the step of bonding a first end portion of the circuit filmto the pad area, heat and pressure are provided to the first end portionof the circuit film, so that the pad area and the circuit film areelectrically connected.
 13. The method of claim 10, wherein in the stepof attaching the printed circuit board to the second end portion of thecircuit film, heat and pressure are provided to the second end portionof the circuit film, so that the printed circuit board and the circuitfilm are electrically connected.
 14. The method of claim 5, the organiclight emitting diode (OLED) display comprising a gate driver, gatewires, a data driver, data wires, and a plurality of pixels, the displaypanel including the plurality of pixels being positioned on the displayarea, the display panel including the gate wires and the data wiresbeing positioned on both the display area and the pad area.
 15. Themethod of claim 14, wherein at least one of the gate driver and the datadriver is installed to the circuit film to drive the display panel, andthe circuit film is made of a chip on film or a tape carrier package.16. The method of claim 14, wherein the gate driver and the data driverare positioned on the pad area as a chip on glass, and the circuit filmis made of a flexible printed circuit film.